Laile Optoelectronics sincerely invites you to visit our booths 10D59 and 4D208 for exhibition tours, exchanges, and cooperation discussions!
For the first time, Laile Optoelectronics will adopt a dual-hall exhibition format, spanning Hall 4 and Hall 10, with Hall 10 serving as our primary exhibition space. At the show, we will present three automated equipment systems—the Pump laser coupling system, the DFB small-lens coupling system, and the dual-lens coupling system—along with live demonstrations at our booth. We warmly invite all attendees to visit Booth 10D59 for exchanges and to explore the frontiers of optoelectronic technology together!
The 26th China International Optoelectronic Expo (CIOE) will take place from September 10–12, 2025, at the Shenzhen World Exhibition & Convention Center. As the premier international event in the optoelectronics industry, CIOE gathers top global enterprises, research institutes, and industry thought leaders to present state-of-the-art products and innovative solutions across optical communications, laser technology, sensing applications, and other frontier areas.
Company Profile
Wuhan Laile Optoelectronics Technology Co., Ltd. was established in 2015 and is a national high-tech enterprise. Laile Optoelectronics' current product portfolio mainly covers micro-nano-level motion control systems, semiconductor chip test systems, etc., supporting various materials such as silicon photonics, thin-film lithium niobate, III-V compounds, SiC, and GaN. These products can be applied across a wide range of industries, including industrial automation inspection, laser technology, biomedical, aerospace, and more.
The company focuses on high-precision automation equipment and has obtained dozens of core technology patents and multiple software copyrights, maintaining a leading position in the industry. Laile Optoelectronics has provided micron- and nanometer-level motion control systems and chip test system solutions to numerous industry-leading enterprises, key universities, and national research institutes worldwide, establishing itself as a leading high-end equipment supplier in the industry.
Featured products
Dual-Lens Automatic Coupling & Packaging System
The dual-lens automatic coupling and packaging system is suitable for lens coupling and optical path shaping. The equipment features image recognition and positioning capabilities, enabling automated loading, automatic dispensing, and UV curing. It is applicable to various materials such as silicon photonics, thin-film lithium niobate, and III-V compounds. By configuring different peripheral equipment, it can also accommodate various packaging scenarios including AuSn soldering, glass solder, and laser welding. The equipment features a modular design, allowing it to accommodate a wide range of lens types and devices with simple fixture changes—offering broad applicability and strong expandability.
Dual-FA Automatic Coupling System
The dual-FA automatic coupling system is a self-developed automatic coupling device compatible with both TX and RX ends. The equipment can automatically adjust the relative parallelism between the PCB board and the FA, and simultaneously perform TX-end-to-FA end-face coupling as well as RX-end-to-FA vertical coupling, with automatic dispensing and UV curing. This equipment is suitable for various materials such as silicon photonics, thin-film lithium niobate, and III-V compounds.
Y-Waveguide Automatic Coupling Equipment
The Y-waveguide automatic coupling equipment is a high-precision automated system specifically designed for integrated optical Y-waveguide components. Utilizing three sets of six-axis precision motorized stages combined with real-time feedback of optical power and extinction ratio, the system enables rapid automatic alignment and coupling between the polarization-maintaining fiber array (PM FA) and the Y-waveguide chip, followed by automatic dispensing and UV curing. The equipment supports polarization state optimization and multi-channel synchronous calibration, and is compatible with various Y-waveguide structures (such as lithium niobate or silicon-based waveguides). This system significantly improves production efficiency and consistency, and is suitable for a wide range of materials including silicon photonics and thin-film lithium niobate.
Laser Automatic Coupling System
The laser automatic coupling system is an automatic coupling device designed for butterfly-packaged devices. It is suitable for coupling and packaging scenarios where optical fibers are inserted into the butterfly package housing. The system effectively addresses the challenges of precise fiber threading, flexible clamping, and efficient coupling and packaging. It is compatible with various packaging processes including adhesive bonding, glass solder, and laser welding.
Planar Lightwave Circuit (PLC) Automatic Coupling Test System
The PLC automatic coupling test system can simultaneously meet both chip coupling and testing requirements. The system supports coupling and testing for different types of planar lightwave circuit devices, with flexible parameter configuration, a visual user interface, and user-friendly operation. The equipment is suitable for various materials including silicon photonics, thin-film lithium niobate, and III-V compounds.
