From May 18–20, Wuhan Laile Optoelectronics will bring a range of automated equipment to the 21st Wuhan Optical Expo. Our booth is located at Hall B2, Booth 2B14. We welcome you to visit us for discussions and collaboration!
As a bellwether of the optoelectronics and information industry, this year's expo focuses on four core sectors: laser technology and applications, optics and precision optics, optical communications and all-optical networks, and optoelectronic integration and innovative applications. The exhibition covers key industries including automotive, new energy, aerospace, and biomedical, and is dedicated to empowering the upgrade and innovative development of Central China's industries through optoelectronic technology.
Company Profile
Laile Optoelectronics has been consistently focused on the field of high-precision automation equipment. Since its establishment, leveraging its core technologies and independent innovation capabilities, the company has achieved diversified and orderly development. Our current product portfolio mainly covers micro-nano-level motion control systems, semiconductor chip coupling and packaging test systems, etc., supporting various materials such as silicon photonics, thin-film lithium niobate, III-V compounds, SiC, and GaN. These products can be applied across a wide range of industries, including industrial automation inspection, laser technology, biomedical, aerospace, and more.
Featured Models
Dual-Lens Automatic Coupling & Packaging System
The dual-lens automatic coupling and packaging system is suitable for lens coupling and optical path shaping. The equipment features high-precision image recognition and positioning functions, and supports automated loading, automatic dispensing, and UV curing. It is applicable to various materials such as silicon photonics, thin-film lithium niobate, and III-V compounds. By configuring different peripheral equipment, it can also accommodate various packaging scenarios including AuSn soldering, glass soldering, and laser welding.
The equipment is easy to operate and is equipped with multi-layer magazines for batch loading. The single-machine cycle efficiency is less than 2 minutes, and it is compatible with the coupling and packaging of 800G/1.6T optical modules.
Dual-FA Automatic Coupling System
The dual-FA automatic coupling system is a self-developed automatic coupling device compatible with both TX and RX ends. It features high-precision image recognition and positioning functions, can automatically adjust the relative parallelism between the PCB board and the FA, and simultaneously perform TX-end-to-FA end-face coupling as well as RX-end-to-FA vertical coupling, with automatic dispensing and UV curing. It is equipped with multi-layer magazines for batch loading, and the single-machine cycle efficiency is less than 3 minutes.
It is widely compatible with packaging of various materials such as silicon photonics, thin-film lithium niobate, and III-V compounds. With a high degree of automation and strong production capacity, it enables efficient large-scale manufacturing.
COB Automatic Coupling System
The COB automatic coupling system is a self-developed COB coupling device featuring one-click operation, convenient loading, high-precision image recognition, and positioning functions. It is suitable for active COB products with a multimode 850 nm wavelength, such as 400G/800G and SR4/SR8 optical modules.
The equipment can automatically identify PCB board position and angle, automatically adjust parallelism, and perform automatic coupling with a coupling cycle of less than 60 seconds. It also features automatic dispensing and UV curing. The equipment is easy to operate, highly automated, and offers excellent consistency.
