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Wuhan Laile Optoelectronics Draws Attention at CFCF2026 with Fully Automatic Coupling Test Equipment

  • Published Date : 2026-06-29
  • Views : 227


The 11th Optical Connectivity Forum Conference (CFCF2026) was successfully held from June 25 to 27, 2026, featuring three days of packed and exciting agendas. As a premier industry event focused on AI computing power infrastructure, the conference precisely targeted industry development pain points and opportunities. Centering on multi-scenario AI computing interconnection solutions, it deeply tracked the forefront of technological change and comprehensively connected the entire optical communication industry chain, including chips, components, modules, equipment, terminals, and application implementations. This year's conference brought together over 200 exhibitors and attracted more than 6,000 professional attendees, striving to build a core platform for technical exchange, solution matchmaking, and win-win cooperation. The event promoted a complete closed loop of "technological innovation – scenario implementation – industry empowerment," helping the industry capitalize on the dividends of computing power and achieve high-quality development.

During the exhibition, Wuhan Laile Optoelectronics Technology Co., Ltd. made a significant appearance, showcasing several core products including its Dual-Lens Fully Automatic Coupling Packaging System, Dual-FA Automatic Coupling System, and COB Automatic Coupling System. The company's booth (No. G28) drew considerable attention from industry professionals.


Booth Number:G28


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Established in 2015 and headquartered in Wuhan, Hubei Province, Wuhan Laile Optoelectronics is a nationally recognized High-Tech Enterprise. The company focuses on the development of high-precision automation equipment and holds dozens of core technology patents and multiple software copyrights. It operates a 4,000-square-meter standardized intelligent manufacturing base and has passed the ISO 9001 quality system certification. The company's product portfolio covers micro-nano level motion control systems and semiconductor chip coupling and packaging test systems, supporting a wide range of material systems including silicon photonics, thin-film lithium niobate, III-V semiconductors, SiC, and GaN.


On-Site Interview: Laile Optoelectronics Engages with Industry Media


On the first day of the exhibition, Ms. Wang Han, Sales Director of Wuhan Laile Optoelectronics, gave an interview to the CFCF conference media at the company's booth. During the interview, she provided a detailed introduction to the company's core products and supporting solutions, its overall business performance for the year, and the current industry focus on "production expansion and ensuring delivery." She also shared the company's progress in its expansion plans and engaged in an in-depth discussion with the media.


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Ms. Wang stated: "As a core supplier of coupling equipment, the core value we deliver to our customers is, in essence, cost reduction, efficiency improvement, stable yield rates, rapid delivery, and future-ready adaptability."

Laile Optoelectronics' automated coupling equipment offers four key advantages:

  1. Significant Cost Reduction and Efficiency Improvement: Moving away from traditional coupling methods that rely on skilled workers, which often limit capacity and yield, our systems enable a "one operator, multiple machines" approach. New operators can begin production in just 2 to 3 days.

  2. High Precision and Yield: Utilizing sub-micron positioning and integrated automatic coupling processes, our equipment increases mass production yield rates, ensures stable delivery, and reduces material waste.

  3. Full-Rate and Multi-Material Compatibility: Covering optical modules from 400G to 3.2T, and adaptable to mainstream solutions like silicon photonics and thin-film lithium niobate, our systems offer strong scalability, saving customers the cost of equipment upgrades for future needs.

  4. Sufficient Inventory and Production Capacity: We maintain ample stock of equipment materials and a monthly production capacity of 200 units, with a delivery lead time of 6-8 weeks, enabling us to quickly match our customers' production expansion demands.

Throughout the conference, Laile Optoelectronics had a professional team on-site to provide continuous product demonstrations and explanations.



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The successful conclusion of the Suzhou Optical Connectivity Conference is not an end, but rather a new starting point for Laile Optoelectronics and its partners to embark on a new journey. The company will continue to deepen its presence in the field of high-speed optical chip packaging and testing equipment, striving to become a leader in domestic equipment manufacturing. By focusing on the core link of coupling and packaging, Laile aims to develop a series of high-precision, fully automated, and universally compatible equipment. Looking ahead, Laile Optoelectronics is committed to driving industrial upgrading through technological innovation, contributing to the self-reliance and global leadership of China's optical communication industry.


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