The Dual-Lens Automatic Coupling & Packaging System is designed for lens coupling and optical path shaping. Equipped with high-precision image recognition and positioning capabilities, the system enables automated loading, automatic dispensing, and UV curing. It supports a wide range of materials, including silicon photonics, thin-film lithium niobate, and III-V compound semiconductors. With the integration of different peripheral equipment, it can also accommodate various packaging processes such as AuSn soldering, glass soldering, and laser welding. The system features a modular design, allowing it to adapt to different lens and device specifications with simple fixture changes, offering broad applicability and strong scalability. It is ideally suited for the coupling and packaging of 400G, 800G, and 1.6T optical transceivers.